cadence SPB 16.2下载地址

在本文中,作者分享了如何找到并下载旧版本的Cadence PCB设计软件,包括通过ED2K链接获取ISO文件的过程。

摘要生成于 C知道 ,由 DeepSeek-R1 满血版支持, 前往体验 >

突然要用到这个旧版本的软件,找了好久,累。

 

ed2k://|file|[Cadence.PCB设计].TLF-SOFT-Cadence.Allegro.PCB.Design.v16.2-SHooTERS-CD1.iso|688369664|21d65384b95b9dd1aa4b9325bd12b518|h=VB5Y4JQK6OVW5SUZWL5ZTSMD4FNKUQG6|/
ed2k://|file|[Cadence.PCB设计].TLF-SOFT-Cadence.Allegro.PCB.Design.v16.2-SHooTERS-CD2.iso|682039296|91c10fa8d760742af1fea3c2a9929e9c|h=2I5YUOYLIJ44TDCD3G5ZXFQFNWLFBNJB|/
ed2k://|file|[Cadence.PCB设计].TLF-SOFT-Cadence.Allegro.PCB.Design.v16.2-SHooTERS-CD3.iso|339585024|6e6dd829b325da850cf58f0b048992de|h=72MPJ752SGQZ2QQFKKPHH7Y4GGX4F23X|/
ed2k://|file|[Cadence.PCB设计].TLF-SOFT-Cadence.Allegro.PCB.Design.v16.2-SHooTERS.nfo|9985|62b157743d099f17a45916a03fd39f5b|h=R77WS5D3KIQFX5CLIZM5D6AD42I5TOBU|/

目 录 第 1 章 焊盘制作 .........................................................................................................1 1.1 用 Pad Designer 制作焊盘 ...........................................................................................1 1.2 制作圆形热风焊盘.......................................................................................................6 第 2 章 建立封装 .......................................................................................................10 2.1 新建封装文件.............................................................................................................10 2.2 设置库路径.................................................................................................................11 2.3 画元件封装.................................................................................................................12 第 3 章 元器件布局 ...................................................................................................23 3.1 建立电路板(PCB) ......................................................................................................23 3.2 导入网络表.................................................................................................................24 3.3 摆放元器件.................................................................................................................26 第 4 章 PCB 布线.......................................................................................................31 4.1 PCB 层叠结构 ............................................................................................................31 4.2 布线规则设置.............................................................................................................33 4.2.1 对象(object) ....................................................................................................35 4.2.2 建立差分对.....................................................................................................36 4.2.3 差分对规则设置.............................................................................................37 4.2.4 CPU 与 DDR 内存芯片走线约束规则..........................................................39 4.2.5 设置物理线宽和过孔.....................................................................................45 4.2.6 设置间距约束规则.........................................................................................52 4.2.7 设置相同网络间距规则.................................................................................55 4.3 布线.............................................................................................................................56 4.3.1 手工拉线.........................................................................................................56 4.3.2 应用区域规则.................................................................................................59 4.3.3 扇出布线.........................................................................................................60 4.3.4 差分布线.........................................................................................................62 4.3.5 等长绕线.........................................................................................................64 4.3.6 分割平面.........................................................................................................65 第 5 章 输出底片文件 ...............................................................................................70 5.1 Artwork 参数设置 ......................................................................................................70 5.2 生成钻孔文件.............................................................................................................75 5.3 输出底片文件.............................................................................................................79
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