BGA

最新推荐文章于 2025-10-15 15:29:56 发布

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本文介绍了BGA（Ball Grid Array）芯片封装技术，它是一种流行的表面贴装芯片封装，具有尺寸紧凑、引脚数量多、电感低等特点，便于与印刷电路板对齐，还推动了芯片级封装发展。文中还提及了BGA焊球、封装类型及不同接触方式。

bga - (Ball Grid Array) A popular surface mount chip package that uses a grid of solder balls as its connectors. Available in plastic and ceramic varieties, BGA is noted for its compact size, high lead count and low inductance, which allows lower voltages to be used. BGA chips are easier to align to the printed circuit board, because the leads, which are called "solder balls" or "solder bumps," are farther apart than leaded packages. Since the leads are underneath the chip, BGA has led the way to chip scale packaging (CSP) where the package is not more than 1.2x the size of the semiconductor die itself. See chip package, MicroBGA and flip chip.

BGA Solder Balls
These are the undersides of BGA packages showing the solder balls. The small one on the ruler is a µBGA (MicroBGA) chip from Tessera. Using the entire square of the chip package for leads is an advantage of the BGA method. (Image samples courtesy of Amkor Technology, Inc.)

BGA Package Types

These cross sections show BGA packages in standard and CSP varieties. (Illustration courtesy of Joseph Fjelstad.)

Different Contact Types

The solder balls can be made to connect to the printed circuit board using various contact methods as illustrated here. (Illustration courtesy of Joseph Fjelstad.)