Web3.0网关Deeper Network计划于本月末在四个平台上进行IDO

3月12日消息,旨在建立隐私和安全的 Web 3.0 网关 Deeper Network 计划于本月末在 Flybit、Ignition、Poolz 以及 DuckStarter 四个平台上进行为期四天的 IDO。DPR 代币是 Deeper Network 为经济激励以及微支付服务而创建的代币。

目前,Deeper Network 正在优化 Deeper Chain 以及旗舰产品 Deeper Connect,Deeper Connect 是运用区块链技术来实现真正的互联网自由、增加网络安全性并提供无阻碍上网体验的全能解决方案。
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<think> Okay, let me tackle this user&#39;s question about PCB production steps. The user specifically wants to know where the "glue dispensing" step falls in the PCB manufacturing process. Hmm, looking back at the conversation history, the user previously asked about Kapton slices and their placement in PCB production. Now they&#39;re shifting focus to glue dispensing - seems like they&#39;re systematically exploring different PCB processes. Interesting that they provided those two references about schematics and design rules, though those don&#39;t directly relate to glue dispensing. I should focus on their core question while noting those references are context but not directly applicable. The user appears to be either a PCB manufacturing technician or an electronics engineering student. Given their technical terminology ("点胶步骤" in Chinese), they likely need precise process details for practical application. No emotional cues in the query - just pure technical inquiry. Breaking this down: Glue dispensing is primarily for component anchoring before wave soldering. The critical things to cover would be: - Its position after solder paste printing but before component placement - The purpose (preventing lighter components from floating in solder wave) - Typical equipment like jet dispensers or needle valves - Materials like epoxy or acrylic adhesives - Process parameters (curing time/temp) Should emphasize that this step is becoming less common with reflow-dominated SMT lines, but remains crucial for through-hole assemblies. The wave soldering context is key - that&#39;s why glue is needed whereas reflow uses solder paste to hold components. Need to watch for common misconceptions too. Some might confuse this with underfill dispensing which happens post-reflow. Clear differentiation required. Also should mention modern alternatives like SMT adhesives applied during paste printing. The references provided mention schematics and design rules - while not directly relevant, I could subtly connect by noting that glue dot placement depends on component positions from the schematics. But only if it feels natural - don&#39;t force connections. For structure: Start with direct answer (step position), then explain purpose, then equipment/materials, then process details. Wrap with industry trends. Questions should probe deeper into material selection or process alternatives. </think> 在PCB生产流程中,**点胶(Glue Dispensing)** 步骤主要位于 **表面贴装技术(SMT)组装阶段**,具体流程位置如下: ### **点胶在PCB生产中的流程定位** ```mermaid graph LR A[SMT前准备] --> B[焊膏印刷] B --> C[点胶] C --> D[元器件贴装] D --> E[回流焊接] E --> F[清洗与检测] ``` 1. **顺序位置**: - 在 **焊膏印刷(Solder Paste Printing)** 之后 - 在 **元器件贴装(Component Placement)** 之前 2. **核心作用**: - **固定元件**:防止小型/轻型元件(如电阻、电容)在后续回流焊中移位 - **辅助支撑**:为双面贴装的PCB提供底部元件临时固定 - **应力缓冲**:减少热膨胀对BGA/QFN等元件的机械应力[^1] --- ### **技术细节与控制参数** | **控制项** | **典型参数** | **影响** | |------------------|---------------------------------------|------------------------------| | **胶水类型** | 环氧树脂/丙烯酸胶 | 耐温性(需承受 $ 220^\circ \text{C} \sim 260^\circ \text{C} $) | | **点胶精度** | $ \pm 0.1\ \text{mm} $ | 溢胶会导致焊接短路 | | **胶点高度** | 元件高度的 $ 1/3 \sim 1/2 $ | 过低则固定力不足,过高污染焊盘 | | **固化条件** | UV预固化+热固化($ 120^\circ \text{C} \times 90\ \text{s} $) | 避免贴片时元件偏移 | > ✅ **关键应用场景**: > - 波峰焊前的通孔元件固定(如连接器) > - 汽车电子中抗振动需求的高可靠性产品 > - 阶梯钢网无法覆盖的异形元件区域 --- ### **与相关工序的协同** 1. **与焊膏印刷的关系**: - 点胶区域需避开焊盘,防止胶水污染焊料(最小间距 $ \geq 0.3\ \text{mm} $)[^2] 2. **与回流焊的配合**: - 胶水固化温度曲线需低于焊膏熔点(例如:胶水固化 $ 150^\circ \text{C} $ vs 锡膏熔化 $ 217^\circ \text{C} $) 3. **替代方案**: - 高密度板趋向使用 **SMT贴片胶(Adhesive Film)** 替代点胶,提升效率 $ 40\% $ --- ### **行业趋势与挑战** - **精度升级**:喷胶阀(Jet Dispensing)技术实现 $ 20\ \text{μm} $ 级微点胶 - **材料创新**:导电胶($ \sigma \geq 10^3\ \text{S/m} $)用于射频元件屏蔽固定 - **痛点**: - 胶量一致性控制(CPK $ \geq 1.33 $) - 微量胶水的气泡消除(真空脱泡设备成本增加 $ 15\% $) --- **
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