MT8516 Technical Brief PDF文件资料

MT8516 Technical Brief PDF文件资料

 1 System Overview

MT8516 is a highly integrated connected audio platform incorporating application processing and connectivity subsystems to enable connected audio applications. The chip integrates a Quad-core ARM® Cortex-A35 MPCoreTM operating up to 1.3 GHz. The MT8516 interfaces to NAND flash memory, LPDDR2, LPDDR3, DDR3, DDR3L and DDR4 for optimal performance and also supports booting from eMMC to minimize the overall BOM cost. In addition, an extensive set of interfaces such as TDM/PDM inputs are included for microphone voice input control / search applications on connected audio products.  

 

The application processor, a Quad-core ARM® Cortex-A35 MPCoreTM which includes a NEON multimedia processing engine.  

 

MT8516 includes two wireless connectivity functions, WLAN and Bluetooth. The RF parts of those two blocks are also built-in MT8516 chip which can support 802.11 bgn. With two advanced radio technologies integrated into one single chip, MT8516 provides the best and most convenient connectivity solution among the industry. MT8516 implements advanced and sophisticated Radio Coexistence algorithms and hardware mechanisms.  It also supports single antenna sharing among 2.4 GHz antenna for Bluetooth, WLAN. The enhanced overall quality is achieved for simultaneous voice, data, and audio transmission. The small footprint with low-power consumption greatly reduces the PCB layout resource.

 

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1.1 Platform Features

· AP MCU subsystem

- Quad-core ARM® Cortex-A35 MPCoreTM operating at 1.3 GHz

- NEON multimedia processing engine with SIMDv2 / VFPv4 ISA support

- 32KB L1 I-cache and 32KB L1 D-cache

- 512KB unified L2 cache

- DVFS technology with adaptive operating voltage from 1.05V to 1.31V

 

 

· Wireless Connectivity MCU subsystem

- Andes N9 processor with 48KB I-cache, 40KB D-cache

 

 

· External memory interface

- Supports LPDDR2, LPDDR3, DDR3/L, DDR4 up to 2GB

- 32-bit data bus width

- Memory clock up to 800 MHz

- Supports self-refresh/partial self-refresh mode

- Low-power operation

- Programmable slew rate for memory controller’s IO pads

- Supports dual rank memory device

- Advanced bandwidth arbitration control

 

 

· Security

- ARM® TrustZone® Security

 

 

· Storage

- NAND flash controller supporting NAND bootable, iNAND2® and MoviNAND®

- 3 sets of memory card controller supporting SD/SDHC/MMC and SDIO2.0/3.0 protocols

 

 

· Connectivity

- Two USB ports, port0 support USB 2.0 OTG mode but port1 only support USB 2.0 host mode. The two USB20 ports support connection Hub to transfer data communications with HS/FS/LS Device. USB2.0 high-speed dual mode supporting 8 Tx and 8 Rx endpoints.

- 3 UARTs for external devices and debugging interfaces

- SPI master for external devices

- 3 I2C to control peripheral devices, e.g. CMOS image sensor, or LCM module

- I2S master output and master/slave input for connection with optional external hi-end audio codec

- GPIOs

- 10M/100M Ethernet MAC with MII and RMII interface

- IR receiver

 

 

 

 

· Operating conditions

- Core voltage: 1.15V

- Processor DVFS+SRAM voltage : 1.15V~1.31V (Typ. 1.15V ; sleep mode 0.85V)

- I/O voltage: 1.8V/2.8V/3.3V

- Memory: 1.2V/1.35V/1.5V

- NAND: 1.8V/3.3V

- LCM interface: 1.8V/3.3V

- Clock source: 26-MHz, 32.768-kHz  

 

 

· Package

- Type: WB TFBGA

- 12.6mm x 13.1mm  

- Height: 1.2 mm maximum

- Ball count: 406 balls

- Ball pitch: 0.5mm

 

 

1.2 Multimedia Features

· Display

- Supports landscape or portrait panel resolution up to FWXGA (1366x768)

- MIPI DSI interface (4 data lanes)

- Single link LVDS interface

- Supports RGB interface panel

 

 

· Audio

- I2S Master mode sampling rates supported: 8kHz to 192kHz

- I2S In Slave mode sampling rates supported: 8kHz to 48kHz

- Sample formats supported: 16-bit/24-bit, Mono/Stereo

- Interfaces supported: DAI, I2S, TDM, SPDIF

- Flexible and powerful audio post-processing technologies  

- Supports DIR(SPDIF-input) decode: supports 32, 44.1, 48, 88.2, 96kHz sample rate.

- Supports SPDIF-output encode: supports 32, 44.1, 48, 88.2, 96kHz sample rate.

- Supports Time Division Multiplexer I2S output (master mode only): supports 8, 11.025, 12, 16, 22.05, 24, 32, 44.1, 48, 88.2, 96, 192kHz sample rate and

channel number up to 2/4/8 in configuration by 1/2/4 data pins (corresponding to 2/4/8 channels),  

- Dedicated pin for TDM TX (not share clock pins with TDM RX).

- Supports Time Division Multiplexer input: supports 8, 11.025, 12, 16, 22.05, 24, 32, 44.1, 48, 88.2, 96, 192kHz sample rate and channel number up to 2/4/8 in 1 serial data pin,  

- Dedicated pin for TDM RX (not share clock pins with TDM TX).

 

 

· Speech

- Noise reduction

- Noise suppression

- Dual-MIC noise cancellation

- Echo cancellation

- Echo suppression

- Dual-MIC input

- Digital MIC input

 

 

· HDMI transmitter

- Built-in HDMI TX 1.4 supports Full HD 1080p video output

- Audio return channel  

 

 

  

1.3 Wi-Fi/Bluetooth Features

· Supports integrated Wi-Fi/Bluetooth

- Supports single antenna for Bluetooth and WLAN

- Self calibration

- Best-in-class current consumption performance

- Intelligent BT/WLAN coexistence scheme that goes beyond PTA signaling (for example, transmit window and duration that take into account protocol exchange sequence, frequency, etc.)

 

 

· Wi-Fi

- Single-band (2.4GHz) single stream 802.11 b/g/n MAC/BB/RF

- 802.11 d/h/k compliant

- Security: WFA WPA/WPA2 personal, WPS2.0, WAPI (Hardware)

- QoS: WFA WMM, WMM PS

- Supports 802.11n optional features: STBC, A-MPDU, Blk-Ack, RIFS, MCS feedback, 20/40MHz coexistence (PCO), unscheduled PSMP

- Supports 802.11w protected managed frames

- Supports Wi-Fi Direct (WFA P-2-P standard)  

- Supports HotSpot 2.0 Passpoint

- Per packet TX power control

 

 

· Bluetooth

- Bluetooth specification v2.1+EDR

- Bluetooth v4.0 Low Energy (LE)

- Rx sensitivity: GFSK -95dBm, DQPSK -94dBm, 8-DPSK -88dBm

- Best-in-class BT/Wi-Fi coexistence performance

- Up to 4 piconets simultaneously with background inquiry/page scan

- Supports Scatternet

- Packet Loss Concealment (PLC) function for better voice quality

- Low-power scan function to reduce power consumption in scan modes 

 

 

 

 

  

1.4 General Description

 

MediaTek MT8516 has integrated 802.11 b/g/n and Bluetooth 4.0 + HS radios and passive devices (IPD) to provide a connected audio solution. The application processor incorporates a high efficient 64-bit Quad Cortex-A35 processor operating at 1.3 GHz. Rich memory interfaces (PCDDR3, DDR4, LPDDR3, eMMC, Raw NAND) provide high flexibility to support variant memory configurations. The elaborate MMD (MediaTek Module Design) provides verified schematics and PCB layout for memory and power source to reduce development time. Combo chip MT6630, 802.11ac/BT also gives the alternative to fullfill high end WiFi/BT requirement. MT8516 processor delivers high-performance computing, low-power consumption, and good multimedia experience.

World-leading technology

Based on MediaTek’s world-leading SoC architecture with advanced 28nm RF process, the MT8516 integrates digital and RF into one chip that is suitable for compact PCB design. The PMIC, MT6392, is designed to supply all the power to MT8516 itself. The two-chip solution brings lower rBOM and design effort to cost-effectively develop applications with fast time to market.

 

 Flash I/FUSBSDIOI2CGPIOCoresightPowerManagementRTC I/FAudioCODECCortexA35CortexA35CortexA35CortexA35512KB L2INTCTimerDMABoot ROMDualDisplay Wi-Fi802.11b/g/nBluetooth4.0 + HSConnectivityRFEMIPC / USB DevicesI2C DevicesDDR3 32bit1600MbpsNANDDebugFacilityMT6392DC/DCLDOGaugeLCMTVMT8516WiFi/BTAntennaHDMIMIPI / LVDSAudio codecSpeaker AMP6630(option)(wifi/BT/GPS)eMMC /SD / SDIOeMMC,SD Card(option)

 

Figure 1-1: Block Diagram of MT8516

 

1 System Overview MT8665具有集成的蓝牙、FM、WLAN和GPS模块,是一个高度集成的基带平台,集成了调制解调器和应用程序处理子系统,使L。TE智能平台应用程序。该芯片集成了四核ARM Cortex-A53,最高可达1.5GHz,ARM Cortex-R4单片机和功能强大的多标准视频编解码器。此外,一套广泛的接口和连接外围设备包括接口到相机,触摸屏显示器和MMC/SD卡。 该应用程序处理器是一个四核ARM Cortex-A53 MPCoreTM,配备了霓虹灯引擎,为支持最新的OpenOS及其要求很高的应用程序提供了必要的处理能力。作为网页浏览,电子邮件,GPS导航和游戏。所有这些都是在一个高分辨率触摸屏显示与图形增强的2D和3D图形加速。 多标准视频加速器和高级音频子系统也集成在一起,提供先进的多媒体应用程序和服务,如流媒体音频和视频、多种音频和服务。解码器和编码器。 ARM Cortex-R4、DSP、2G和3G协处理器组合提供强大的调制解调器子系统,能够支持LTE Cat 4、24 HSDPA下行链路和第7类HSUPA上行链路数据速率,类别14 TD-HSDPA下行链路和第6类TDHSUPA上行链路,以及第12类GPRS,EDGE。 MT8665还体现了无线通信设备,包括wlan蓝牙和gps。通过将四种先进的无线电技术集成在一块芯片上,MT 8665提供了最好和最先进的通信设备。业界卓越的连接解决方案。 提高了在视频记录器和智能平台上同时传输语音、数据和音频/视频的总体质量。占地面积小,功耗低,极大地减少了PCB布局资源。
MT8516简介: MT8516支持四核心64位ARM:registered:Cortex-A35:trade_mark:,主频达1.3GHz。该芯片还内建WiFi 802.11 b/g/n和支持蓝牙4.0。该芯片还提供多种存储规格,包括LPDDR2、LPDDR3、DDR3、DDR3L和DDR4。 MT8516还支持多达8个TDM通道和2个PDM输入,以支持来自多个源的音频输入,适用于远场(Far-field)麦克风语音控制和智能音响设备。 MT8516芯片拥有更小的占板面积,更有助于终端厂商简化设计,整体来看,MT8516是一个高效节能的应用处理平台。 分享MT8516智能AI音箱核心板PCB资料,给需要的朋友。 MT8516智能AI音箱核心板PCB截图: 注意: PCB需要使用PADS打开。 Mentor最近推出了“IoT PCB 设计的 7 个设计方面”、“DDR SDRAM – 设计优势与信号完整性挑战”两个个主题的白皮书: 1.IoT PCB 设计的 7 个设计方面 对消费者而言,IoT 设备看起来时尚而又简单,但它们实际包含一组截然不同的元器件、物理接口和 PCB,以及在设计和 Layout 上具有独特挑战的电路。本文将介绍在设计 PCB 以实现成功的 IoT 设备时需要考虑的七大注意事项。 2.DDR SDRAM – 设计优势与信号完整性挑战 DDR SDRAM 给电子产品带来了强大的功能,但与其他高速设计技术一样,要在 PCB 设计中采用该技术可能面临诸多挑战。详细了解影响信号完整性的因素、DDR 存储器件带来的信号完整性挑战,以及在使用 DDR SDRAM 的设计中为确保信号完整性可以采取的做法。
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