PCB的EMC设计

1、PCB的EMC简单对策
     同系统EMC的解决措施一样,PCB的EMC也要针对其三要素(干扰源、耦合途径、敏感装置)对症下药:
          降低EMI强度
          切断耦合途径 
          提高自身的抗扰能力 
          针对PCB的耦合途径之一传导干扰,我们通常采用扩大线间距、滤波等措施;
          针对PCB的耦合途径之二辐射干扰,我们通常主要采取控制表层布线,增加屏蔽等手段;
2、单板层设置的一般原则 
       A.元器件下面(顶层、底层)为地平面,提供器件屏蔽层以及顶层布线提供回流平面;
       B.所有信号层尽可能与地平面相邻(确保关键信号层与地平面相邻),关键信号不跨分割;
       C.尽量避免两信号层直接相邻;
       D.主电源尽可能与其对应地相邻;
       E.兼顾层压结构对称;
       以六层板为例,以下有3种方案:
           A.S1 G1 S2 S3 P1 S4
           B. S1 G1 S2 P1 G2 S3
           C. S1 G1 S2 G2 P1 S3
       优先考虑方案B,并优先考虑布线层S2,其次是S3、S1;
       在成本较高时,可采用方案A,优选布线层S1,S2,其次是S3,S4;
       对于局部、少量信号要求较高的场合,方案C比方案A更合适;(为什么?)
       (注意,在考虑电源、地平面的分割情况下,实际情况因分割等因素可能有所出入)
3、电源、地系统的设计
     3.1 滤波设计
             3.1.1滤波电路的基本概念
                  滤波电路是由电感、电容、电阻、铁氧体磁珠和共模线圈等构成的频率选择性网络,低通滤波器是EMC抑制技术中普遍应用的滤波器,低频信号可以很小的衰减通过,而高频信号则被滤除。
             3.1.2 电源滤波
                 电源的滤波有三层: 
                 A. 电源经滤波处理后,分别跨入单板各模块,此部分中间的电源通路滤波处理
                 B. 板级滤波:储能、滤波电容
                 C. 元件级滤波:去耦电容 
            3.1.2.1 典型分散式供电单板电源的设计
                 A.按照原理框图布局,电源流向清晰,避免输入、输出交叉布局;
                 B.先防护&#

Table of Contents 1. Grounding and Planes...................................................................................................... 7 1.1 Filters ............................................................................................................................ 7 1.2 Routing ......................................................................................................................... 8 1.3 Plane slots and boundaries .......................................................................................... 9 1.4 Decoupling capacitors ................................................................................................ 10 1.5 Power Distribution Network Impedance .................................................................... 11 2. High Speed Considerations ............................................................................................ 13 2.1 Identifying High Speed Signals ................................................................................... 13 2.2 Impedance .................................................................................................................. 14 2.2.1 Single Ended Characteristic Impedance ............................................................. 15 2.2.2 Differential Impedance ....................................................................................... 16 2.3 Terminations............................................................................................................... 18 2.3.1 Single Ended Terminations ................................................................................. 18 2.3.2 Differential Terminations ................................................................................... 20 2.4 Placement ................................................................................................................... 22 2.4.1 Partitioning ......................................................................................................... 22 2.4.2 Zoning ................................................................................................................. 22 2.4.3 Analog Buffers .................................................................................................... 23 2.5 Routing ....................................................................................................................... 24 2.5.1 Topology ............................................................................................................. 24 2.5.2 Bus Routing ......................................................................................................... 26 2.5.3 Corners ............................................................................................................... 28 2.5.4 Vias ..................................................................................................................... 28 2.5.5 Differential Routing ............................................................................................ 28 2.5.6 Proximity to Board Edge ..................................................................................... 30 2.6 Signal Timing ............................................................................................................... 31 2.6.1 Identifying time-critical signals ........................................................................... 31 2.6.2 Propagation time ................................................................................................ 32 2.6.3 Eye diagram analysis .......................................................................................... 32 2.7 Oscillators / Crystals ................................................................................................... 33 3. Crosstalk ......................................................................................................................... 35 3.1 Identifying Victims and Aggressors ........................................................................ 35 3.2 Layer Assignment ................................................................................................... 35 3.3 Orthogonality ......................................................................................................... 36 3.4 Parallelism .............................................................................................................. 36 3.5 Guarding ................................................................................................................. 37 3.6 Return paths ........................................................................................................... 38 3.7 Receiver Placement ................................................................................................ 39 4. EMC Considerations ....................................................................................................... 42 4.1 General Considerations .............................................................................................. 42 4.2 Components ............................................................................................................... 42 4.2.1 Component selection ......................................................................................... 43 4.2.2 High speed filters ................................................................................................ 43 4.2.3 Unused pins ........................................................................................................ 44 Page 5 of 76 Copyright © 2014 EMC FastPass 4.2.4 Heatsinks ............................................................................................................ 44 4.2.5 Shielded components ......................................................................................... 44 4.3 Power Supply .............................................................................................................. 45 4.3.1 Mains .................................................................................................................. 45 4.3.2 Voltage regulators .............................................................................................. 45 4.3.3 Switching mode power supplies ......................................................................... 46 4.4 Routing ....................................................................................................................... 47 4.4.1 Clock distribution ................................................................................................ 47 4.4.2 Guarding ............................................................................................................. 48 4.4.3 Stubs ................................................................................................................... 49 4.5 System design ............................................................................................................. 49 4.5.1 Chassis grounding ............................................................................................... 49 4.5.2 Cables ................................................................................................................. 50 4.5.3 Connectors ......................................................................................................... 51 4.6 ESD & Safety ............................................................................................................... 52 4.6.1 Connectors ......................................................................................................... 52 4.6.2 Sensitive pins .......................................................................................................... 54 4.6.3 High Voltage ........................................................................................................... 54 5. Design for Test ............................................................................................................... 55 5.1 Test Points .................................................................................................................. 55 5.2 Tooling Pins ................................................................................................................ 55 5.3 Push fingers ................................................................................................................ 56 5.4 Sealing ........................................................................................................................ 56 5.5 AOI .............................................................................................................................. 56 6. Design for Manufacture ................................................................................................. 57 6.1 Stackup ....................................................................................................................... 57 6.1.1 Symmetry ........................................................................................................... 57 6.1.2 Drill pairs ............................................................................................................. 57 6.1.3 Copper balance ................................................................................................... 58 6.2 Design Rules Check ..................................................................................................... 59 6.2.1 Clearance ............................................................................................................ 59 6.2.2 Width .................................................................................................................. 60 6.2.3 Annular Ring ....................................................................................................... 60 6.2.4 Slivers .................................................................................................................. 60 6.2.5 Acid Traps ........................................................................................................... 61 6.2.6 Silkscreen Over Pads ........................................................................................... 62 6.3 Mechanical ................................................................................................................. 62 6.3.1 Mechanical Drawings ......................................................................................... 62 6.3.2 Drill Drawings ..................................................................................................... 63 6.3.3 Slots .................................................................................................................... 63 6.3.4 Mounting holes .................................................................................................. 64 6.3.5 Panelization ........................................................................................................ 64 6.3.6 PCB manufacturing specifications ...................................................................... 65 6.4 Assembly Considerations ........................................................................................... 66 6.4.1 Assembly Flow .................................................................................................... 66 6.4.2 Stencils ................................................................................................................ 66 6.4.3 Panelized Assembly ............................................................................................ 67 6.4.4 Decals ................................................................................................................. 67 6.4.5 Fiducials .............................................................................................................. 68 Page 6 of 76 Copyright © 2014 EMC FastPass 6.4.6 Thermal Relief .................................................................................................... 69 6.4.7 Assembly drawings and BOM ............................................................................. 69 6.4.8 PCB Assembly Specifications .............................................................................. 70 6.5 Manufacturing files .................................................................................................... 71 6.5.1 Gerber ................................................................................................................. 71 6.5.2 NC Drill ................................................................................................................ 71 6.5.3 Pick & Place ........................................................................................................ 71 6.5.4 Test Point Report ................................................................................................ 71 7. Thermal considerations ................................................................................................. 72 7.1 Power Dissipation ....................................................................................................... 72 7.2 Heatsinks .................................................................................................................... 72 7.3 Cooling Areas .............................................................................................................. 73 7.4 Current Carrying Capacity .......................................................................................... 73 8. Helpful Utilities .............................................................................................................. 75 8.1 IPC7351 Land Pattern Calculator ................................................................................ 75 8.2 PCB Fabrication Wall Chart ......................................................................................... 75 8.3 PCB Calculators ........................................................................................................... 75 8.4 Filter Selection Simulator ........................................................................................... 76 8.5 Circuit Simulation Tools ...........................................................
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