- 博客(9)
- 资源 (9)
- 收藏
- 关注
RSS订阅原创 0Ω电阻的作用
调试的时候，一个电路的信号既来自电路a也来自电路b；3 调试时可以暂时替代掉低通滤波的的电容电感让信号先导通，等调试电容电感的时候再换回去；那就在他们之间加个0Ω电阻，调试的时候先不焊上，这样就把电路a和电路b给隔离开了；这里除了最后一个在电路中具有实际作用，前面3个都是调试时使用，那不是实际用不上吗？0Ω电阻的额定电流为2A，最大电流为10A，数据来自别人博客上截的数据手册；0Ω电阻是理论值0Ω的电阻，实际值通常为10mΩ，20mΩ，50mΩ；调试时可以把0Ω电阻拆掉，然后把端点给万用表测电流用；
2024-03-18 20:05:00
625
原创 压缩算法_quicklz使用
1 quicklz quicklz是单片机上一个常见的压缩算法，具体原理没有文档和hash表的相关基础我就不去深究了； 只需要将fileSrc.txt放在桌面，代码可以使用vscode的mingw直接编译；2 quicklz源码 quicklz源码就一个c文件一个h文件，标准库要求就一个<string.h>；移植起来比较简单，直接包含头文件即可； https://g...
2024-02-02 21:15:00
746
原创 Realtek sdk ble profile架构概览
1 bluetooth 蓝牙协议 什么是蓝牙呢？蓝牙是频率为2.4GHz的特高频无线通讯标准；按协议制定的时间将其分为两种类型； 1.1 经典蓝牙BT：以点对点方式创建一对一通信；使用蓝牙3.0标准协议； 1.2 低功耗蓝牙BLE ：以广播(一对多)和网格(多对多)等通信； 使用蓝牙4.0标准协议，兼容3.0；2 ( C/S client server )架构 c/s架构通信的...
2023-10-24 00:01:00
189
原创 Harmony：NativeUI界面添加
1 NativeAbilityFwk框架 对于hi3321芯片的brandy sdk而言，ui的开发是基于NativeAbilityFwk应用框架； NativeAbilityFwk是基于穿戴产品的特点从鸿蒙原生Native中裁剪定制的轻量级UI； JSAbility由JavaScript编写；通过ACE注册到AMS中管理，先放着； NativeAbility由C++编写...
2023-10-20 20:03:00
170
原创 lvgl：对象 obj
1 对象 object 1.1 对象 lv_obj_t 对象object：构建用户界面的基本单位，也称之为控件widgets；对于button,label,image,list等组件都可称之为对象；//lv_obj.h 对象结构体；typedef struct _lv_obj_t { const lv_obj_class_t *class_p; struct ...
2023-08-24 19:19:00
661
原创 $Sub$$和$Super$$的作用
MDK编译器中当原函数已经封装成外部库函数不可修改，或者已经编码烧录在rom中的时候，可以通过"$ sub $ $" 和 " $ super $ $"标志符对原函数进行打补丁操作；在rtthread中使用其对main函数进行了补丁操作，扩展了main函数，在调用main函数之前先初始化了rtthread系统；1.1$ Super$$：标识函数原型，目的是标识函数原型给编译器回调；1.2$ Sub$$： 标识函数原型的补丁函数，编译器会将补丁函数放到原型函数之前或之后执行；1.3 用法/
2023-07-05 15:52:29
1048
原创 rt_timer定时器
1 systick中断处理函数 对于单片机而言，定时器的时钟节拍由systick提供，所以我们在此先记录一下systick中断处理函数； 在systick中断处理函数中对时钟节拍进行自加加，调用rt_timer_check( )对定时器进行扫描；//board.c 使能systick定时器；系统晶振25MHz,RT_TICK_PER_SECOND分频1000;tick定时1ms;...
2023-06-19 13:29:00
227
原创 rtthread_"rt_schedule"优先级调度
3 线程调度scheduler rtthread中对于多线程切换是通过优先级表搭配优先级组进行调度的，优先级表中存储所有线程的node，优先级组中存储线程的优先级； 优先级表通常有32个对象，每个优先级都是一个list_head节点，相同优先级的线程存储在相同优先级链表下； rtos中高优先级的线程可以将低优先级的线程suspend，然后让芯片执行高优先级的线程；对于优先级相同的线程...
2023-06-19 13:28:00
258
原创 机器周期和晶振周期
教科书上的单片机由于性能和工艺的限制没有办法在一个晶振周期内完成一次基本指令操作，所以1个机器周期需要12个晶振周期；机器周期是用来规范指令执行时间的，执行不同的指令需要的机器周期不同；1.2 对于现在能够遇到的51和32位机而言，一个晶振周期就等于一个机器周期；晶振周期是晶体震荡一次所需要的时间，作为单片机的时钟生成器而存在；1.1 对于某些教科书上的51单片机而言，他们的晶振周期和机器周期不相等；那么机器周期和晶振周期有什么联系呢？2 下面以stm32仿真举个例；1 机器周期和晶振周期。
2023-06-12 11:37:04
1527
gd32系列芯片如果下载失败，就使用上面的批处理添加和去除读保护
1 首先连接jflash connect
2 点击压缩包中的批处理
3 然后就可以使用额外的iap在线系统编程下载了；
2025-02-17
PS8822 USB TYPE-C Retiming Redriving Switch 规格书
PS8822 USB TYPE-C Retiming Redriving Switch for USB3.1 Gen2 Device DP 1.4 HBR3 Sink
2024-09-24
windows-ch341转iic协议工具和驱动
1 在c盘下以管理员权限运行i2c_driver.EXE，安装驱动；
安装完之后打开设备管理器，会新增外部接口设备，注意这里不是新增端口；
>>外部接口>>USB-EEP/I2X...CH341A
2 打开供应商的i2c工具；即可使用iic读写；
2024-08-08
SGM4808数据手册
音频点击弹出消除器，
专为高保真音响系统（HiFi Audio System）或便携式设备设计
音频点击弹出消除器的主要功能是在音频信号传输或电源切换时，减少或消除由于各种因素（如开关动作、电源不稳定等）产生的点击和弹出噪声
2024-06-03
中国移动家庭类蓝牙设备接入规范.pdf
中国移动蓝牙协议的profile
本标准主要规定了中国移动智慧家庭蓝牙设备与和家亲APP及蓝牙中枢间的接入方式
及通讯要求，供合作伙伴进行设备对接和集成开发。
2024-02-06
quartus-modelsim工具.rar
包含文件MentorKG.exe和patch_dll.bat；适用于modelsim-altera系列和modelsim系列的大部分版本；笔者所用版本为modelsim-altera10.1d;
1.下载本文件；
2.复制文件中的MentorKG.exe和patch_dll.bat到Modelsim安装目录的win32aloem文件夹下
3.运行patch_dll.bat，将生成的LICENSE.TXT文件另存为LICENSE.dat并置于此文件夹下
4.在环境变量的用户环境变量一栏新建环境变量MGLS_LICENSE_FILE、LM_LICENSE_FILE指向LICENSE.dat
2020-07-20
C6678-SPIboot-usersManual.pdf
C6678 SPI Boot Example
Purpose
The purpose of this lab is to demonstrate all the steps that are needed to boot an allocation from SPI
flash memory.
Dependencies:
Code composer Studio v5 or v6
MCSDK or Processor SDK RTOS software for C6678
Note: Files under mcsdk_2_01_XX_YY\tools\boot_loader have been moved to
pdk_c66xx_2_0_0\packages\ti\boot
Task 1: Observe the source file and build the application. Verify that it works
correctly
The example application included in the package can be built using gmake or CCS in the Windows
environment
2020-06-08
MT6328_PMIC_Data_Sheet_V1.pdf
完整版数据手册，共304页；
Document Revision History .............................................................................................2
Table of Contents..............................................................................................................3 1 Overview ..................................................................................................................6
1.1 Features ..................................................................................................................................... 6
1.2 Applications............................................................................................................................... 6
1.3 General Descriptions................................................................................................................. 6
1.4 Ordering Information ................................................................................................................7
1.5 Top Marking Definition .............................................................................................................7
1.6 Pin Assignments and Descriptions .......................................................................................... 8 2 Electrical Characteristics ....................................................................................... 13
2.1 Absolute Maximum Ratings over Operating Free-Air Temperature Range .........................13
2.2 Thermal Characteristic ............................................................................................................13
2.3 Pin Voltage Range ....................................................................................................................13
2.4 Recommended Operating Range ............................................................................................ 17
2.5 Electrical Characteristics ......................................................................................................... 17
2.6 Regulator Output .....................................................................................................................18
2.7 Driver ....................................................................................................................................... 25
2.8 Class AB/D Audio Amplifier................................................................................................... 25
2.9 Audio CODEC.......................................................................................................................... 29
2.10 Battery Charger ........................................................................................................................35
2.11 BC1.x .........................................................................................................................................35
2.12 Down Load Without Battery....................................................................................................35
2.13 AUXADC.................................................................................................................................. 36
2.14 Fuel Gauge............................................................................................................................... 36
3 Functional Descriptions......................................................................................... 37
3.1 General Descriptions................................................................................................................37
3.2 PMIC Functional Blocks ..........................................................................................................37
3.2.1 Power-On/Off Sequence .......................................................................................... 38
3.2.2 Buck Converter and Application Reference ............................................................ 40
3.2.3 Low Dropout Regulator (LDOs) and Application Reference ..................................41
3.2.4 Drivers ....................................................................................................................... 43
3.2.5 Vibrator Driver.......................................................................................................... 44
3.2.6 Audio CODEC and Accessory Detection.................................................................. 45
3.2.7 Class-AB/D Audio Amplifier.................................................................................... 46
3.2.8 Battery Charger (Charger Controller).......................................................................47
3.2.9 AUXADC ....................................................................................................................51
3.2.10 Fuel Gauge .................................................................................................................51
2020-06-04
w25q128fv rev.m 05132016 kms.pdf
2. FEATURES................................................................................................................................................ 5
3. PACKAGE TYPES AND PIN CONFIGURATIONS ................................................................................... 6
3.1 Pin Configuration SOIC / VSOP 208-mil........................................................................................... 6
3.2 Pad Configuration WSON 6x5-mm / 8x6-mm .................................................................................. 6
3.3 Pin Description SOIC / VSOP 208-mil, WSON 6x5-mm / 8x6-mm .................................................. 6
3.4 Pin Configuration SOIC 300-mil........................................................................................................ 7
3.5 Pin Description SOIC 300-mil ........................................................................................................... 7
3.6 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array).............................................................. 8
3.7 Ball Description TFBGA 8x6-mm...................................................................................................... 8
3.8 Pin Configuration PDIP 300-mil ........................................................................................................ 9
3.9 Pin Description PDIP 300-mil............................................................................................................ 9
4. PIN DESCRIPTIONS............................................................................................................................... 10
4.1 Chip Select (/CS) ............................................................................................................................ 10
4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ............................................... 10
4.3 Write Protect (/WP)......................................................................................................................... 10
4.4 HOLD (/HOLD)................................................................................................................................ 10
4.5 Serial Clock (CLK) .......................................................................................................................... 10
4.6 Reset (/RESET) .............................................................................................................................. 10
5. BLOCK DIAGRAM................................................................................................................................... 11
6. FUNCTIONAL DESCRIPTIONS.............................................................................................................. 12
6.1 SPI / QPI Operations ...................................................................................................................... 12
6.1.1 Standard SPI Instructions...............................................................................................................................12
6.1.2 Dual SPI Instructions......................................................................................................................................12
6.1.3 Quad SPI Instructions.....................................................................................................................................13
6.1.4 QPI Instructions..............................................................................................................................................13
6.1.5 Hold Function .................................................................................................................................................13
6.1.6 Software Reset & Hardware /RESET pin .......................................................................................................14
6.2 Write Protection .............................................................................................................................. 15
6.2.1 Write Protect Features ...................................................................................................................................15
7. STATUS AND CONFIGURATION REGISTERS..................................................................................... 16
7.1 Status Registers.............................................................................................................................. 16
7.1.1 Erase/Write In Progress (BUSY) – Status Only..............................................................................................16
7.1.2 Write Enable Latch (WEL) – Status Only .......................................................................................................16
7.1.3 Block Protect Bits (BP2, BP1, BP0) – Volatile/Non-Volatile Writable .............................................................16
W25Q128FV
Publication Release Date: May 13, 2016
- 2 -
2020-06-04
MT6328-MEDIATEK.pdf
数据手册，Document Revision History .............................................................................................2
Table of Contents..............................................................................................................3 1 Overview ..................................................................................................................4
1.1 Features ..................................................................................................................................... 4
1.2 Applications............................................................................................................................... 4
1.3 General Descriptions................................................................................................................. 4
1.4 Ordering Information ................................................................................................................5
1.5 Top Marking Definition .............................................................................................................5
1.6 Pin Assignments and Descriptions .......................................................................................... 6 2 MT6328 Packaging..................................................................................................11
2.1 Package Dimensions ................................................................................................................ 11
Appendix ........................................................................................................................ 12
Lists of Tables and Figures
Table 1-1. MT6328 pin descriptions ............................................................................................................ 6
Figure 1-1. MT6328 VFBGA 206 (6.6x6.6mm) pin assignment................................................................ 6
2020-06-04
签名文件.rar signapk.jar platform.x509.pem platform.pk8
signapk.jar platform.x509.pem platform.pk8
一共包含三个签名文件,用来给安卓程序签名需要使用。
2020-04-09
Fusion Digital Power Designer User Guide.pdf
Fusion Digital Power Designer User’s Guide
For Version 1.3.23 or Higher · User’s Guide Last Updated on 15 September 2007
Documentation for the Microsoft WindowsTM application used to monitor and configure Texas
Instruments UCD91XX and UCD92XX PMBusTM digital power controllers.
2020-03-27
sllu093.pdf
USB TO GPIO转接器的使用说明。用作主机 PC（兼容 IBM™）与一个或多个从属器件（通过标准 A 型转迷你 B 型 USB 电缆实现）之间的接口适配器或桥接器。USB 接口适配器与主机 PC 之间的通信通过 USB 实现，而 USB 接口适配器与从属器件之间的通信通过内部集成电路 (I²C)、SMBus、PMBus 和/或通用输入/输出 GPIO 实现。桥接器转换 USB 与串行协议之间的通信事务
2020-03-24
找不到sdl2.h文件
2023-08-10
TA创建的收藏夹 TA关注的收藏夹
TA关注的人