手机RF开发——HW development

HW development 包括 schematic PCB layout design and debug circuit debug 在整个开发过程中是不断重复的。因为,不同产品的结构不同, layout 不同,最后的测试结果就不同。根据测试结果,最终来确定需要改变或增加 schematics 中的哪些 components ,需要如何修改 layout ,进行最终的优化。所以, HW development 就是一个根据实验结果不断进行性能优化的过程。另外,由于 RF 是高频 layout ,这就更需要注意 RF 的走线要求,严格按照 transceiver PA switch layout guide 对要求网络严格走线。

注: XCV 是射频收发器 transceiver 的简写。

       下面是 SKY74117 SKY77318 schematics 要点。其实其他类型的射频收发器, PA Switch 也一样遵循下面的设计原理,在设计时,可以参考设计。

1 Power supply

 


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Figure4. SKY77318


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Figure5. SKY74117

一般,有源器件会干扰 RF performance ,无源器件不会干扰,只会衰减。所以, Power supply 有源部分的设计对整个 RF 设计比较重要,会影响整个 RF performance 。要点如下:

A Power filter caps 的排列,按照电容值大小,分别从远到近排列到 power 管脚附近。

B SKY77318 VBAT 大电容 C8 特别重要,会影响 switch spectrum 和正常打电话;因为打电话时, PA 发射对电源电压的下拉严重,所以大电容的放电作用可以补偿一部分下拉电压。若没有或者电容不够大,无法补偿发射时的电压降,导致手机无法正常工作。

C SKY74117 VBAT 电容会对 modulation spectrum 产生影响;使用 uF pF 电容并联,在主 VCC1 管脚还需要 10uF 大电容,并且 XCV_VBAT 走线必须在到 PA 前分支出来。防止 PA 对电源产生的影响波及到 XCV 。详细请见 layout guide

2 RAMP RC filter

       RAMP RC filter 起到滤波作用,用于滤除噪声,加大 R C 都会使低通截至频率降低,降低干扰。在频谱的表现上,主要是改善 TX switch spectrum 。但是除了调整 RC 外,必要时,还需要调整 driver TX enable ramp up timing ramping table 。见 Figure6 RAMP 部分。

 


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Figure6. RAMP filter

3 Matching between SW and XCV

 


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Figure7. Matching Circuit between XCV and SW

       这部分 matching 对接收影响很大,会影响 RX level RX sensitivity 。当有线测试模式,发现 RX level 不平坦, RX sensitivity 不好时( layout OK ),可以通过调整 match circuit 来改善。虽然 skyworks 给了 demo ,但是最终还是通过试验结果来决定问题的。调整的时候,可以先从调整 XCV 端的匹配开始,从调整 caps C63/C67 )开始,从右向左方向进行。调整后,有线模式下, RX level 波动范围± 2 ,灵敏度为- 107dBM 以上时为准。

4 Matching between PA and SW and ANT

 


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Figure8. Matching between PA and SW and ANT

PA SW TX 链路上的电容都是用来调节 VSWR PA SW 的电容 C57/C58 ,会衰减发射。若发射功率不够,可以通过调整 caps 来改善。 SW ANT 的电容 C69 ,同时会影响接收 sensitivity 和发射功率。一般, Switch datasheet 都有推荐值,可以先按照推荐值,然后通过试验,来最终确定最佳的 components value

5 Attenuation from XCV to PA

 


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Figure9. Attenuation from XCV to PA

SKY74117 TX 输出功率为 8 12dBm SKY77318 的输入功率要求是 0 6dBm ,所以 117 的输出超过了 318 的输入,需要对输出功率进行适当的衰减才可以满足 PA 输入的要求。这个是设计 schematics 的一个重要要求,输入功率衰减不够,会损坏 PA 。输入衰减过大,则会降低正常发射功率。可以使用π型电阻衰减网络,阻值可以用衰减工具计算获得。

6 AFC RC filter and the crystal selection

 


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Figure10. AFC RC filter

       这部分是和 frequency 相关的。 AFC RC filter BP AFC 滤波,它会影响 frequency tuning 的相应速度。一般,按照 demo 来即可,如果 datasheet 说可以不用,就直接接到 BP Crystal 的选择会影响 clock setup time 。因为 BP 需要 RF 提供 clock ,称其为 RF_CLK RF_CLK 需要注意两个地方,一个是 power on system run system 必须等 RF_CLK 稳定时,才能 run 。另外一个是 paging FINT ,这个是 system wakeup ,也必须等 RF_CLK 稳定时才可以,详细的 timing 解释见后面的 driver development 。但是,确定的是, datasheet DC characteristic 中,会有详细的 clock setup time 。除了阅读 datasheet 外,还需要亲自在示波器上查看 clock setup time

       以上是 SKY74117 SKY77318 schematics 的设计详细描述。

5.2 Layout design

Cell phone RF layout 直接关系到 RF performance Layout 中比较重要的 trace 是: RF trace Power trace clock trace ramp trace 。详细如下(都是英文就不翻译了):

1.    PCB trace design sequence of the whole system

1.    Place all the ground VIAS on the components relevant pads.

2.    Route the VBAT trace to PA. The VBAT trace to PA is the most important power trace. Pay attention of the VBAT branch to XCV and PA. Refer to the layout guide.

3.    Route the VUHF net.

4.    Route the VRF net.

5.    Route the VIO net.

6.    Route the RF strip-lines and micro strip-lines.

7.    Route the PLL loop filters.

8.    Route the PAC circuit.

9.    Route the other RF traces.

10.  Route the audio traces.

11.  Route the digital traces.

       If you layout only the RF part, please skip some steps useless for RF.

2.    The detailed traces layout description
2-1. TX line

·     TX_I+, TX_I-, TX_Q+, TX_Q- should be parallel and symmetry. The I/Q signal traces should be separated by ground.

·   The TXHB and TXLB should be short and surrounded by ground. And this line should be routed as RF line strictly. It should be the 50Ohm matching.

·     VAPC should be short and surrounded by ground.

2-2. RX line

·     All RX lines from T/R switch should be short and routed as RF line strictly. It should be 50Oom matching.

2-3. Power

·     All the power filter caps should be put near the relevant components and pins. And the order is the smallest caps are put the nearest.

·     The power supply trace, such as V_BAT and V_IO should be wide and short. Here set V_BAT trace 80mils on dev board.

·     The voltage of V_BAT is often changing from time to time. So it is better to keep the RF power supply lines far away from V_BAT (it means that place RF far from charging), such as V_RF, V_IO……

·     The XCV V_BAT line should be branched before the PA V_BAT line. And the other PA VCC lines should not be routed via the main PA V_BAT line. Refer to the SKY77318 recommendation.

2-4. GND

·     The GND should not be separated into several parts. It is better one.

·     There are enough ground pins and the corresponding place should not be solder-resist.

·     If possible, the ground layer should not be divided. Keep at least one ground layer completed.

·     The APC circuit is very sensitive. Make the layer bellow ACP circuit a completed GND area.

2-5. Clock line

·     SYSCLK line should be short and protected by GND.

·     The layer under the crystal should be cut off a part which is as big as crystal.

2-6. Antenna

·     Cut off all of the GND plane/layer beneath the antenna pad on every layer. The Antenna line should match the 50Ohm.

2-7. Others

·     The RF traces should be calculated carefully.

·     Components of Microphone input circuit should be put as symmetry as possible.

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