STM32在不完全使用所有资源的情况下，为了提高EMC性能，应将未使用的I/O设置为“0”或“1”，并禁用未使用的功能。推荐的硬件设计包括使用多层PCB，分离地线和电源层，以及良好的接地和电源供应布局。组件位置应根据其EMI贡献进行分离，以减少PCB上的交叉耦合。每个电源供应对需要适当的解耦，且所有未使用的PCB区域应填充额外的接地，以提供屏蔽效果。
引用原文(AN2586)
All microcontrollers are designed for a variety of applications and often a particular application does not use 100% of the MCU resources.
To increase EMC performance, unused clocks, counters or I/Os, should not be left free, e.g.I/Os should be set to “0” or “1”( pull-up or pull-down to the unused I/O pins.) and unusedfeatures should be “frozen” or disabled.
顺带将其他相关推荐设计摘录如下：
5.1 Printed circuit board
For technical reasons, it is best to use a multilayer printed circuit board (PCB) with a separate layer dedicated to ground (VSS) and another dedicated to the VDD supply. This provides good decoupling and a good shielding effect. For many applications, economical reasons prohibit the use of this type of board. In this case, the major requirement is to ensure a good structure f
All microcontrollers are designed for a variety of applications and often a particular application does not use 100% of the MCU resources.
To increase EMC performance, unused clocks, counters or I/Os, should not be left free, e.g.I/Os should be set to “0” or “1”( pull-up or pull-down to the unused I/O pins.) and unusedfeatures should be “frozen” or disabled.
顺带将其他相关推荐设计摘录如下：
5.1 Printed circuit board
For technical reasons, it is best to use a multilayer printed circuit board (PCB) with a separate layer dedicated to ground (VSS) and another dedicated to the VDD supply. This provides good decoupling and a good shielding effect. For many applications, economical reasons prohibit the use of this type of board. In this case, the major requirement is to ensure a good structure f
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