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EMI Produced From Switching FETs and DiodesAny nonlinear component can generate EMI through harmonic generation, both during switching action when pulsed, or when driven to saturation with an AC signal. The two most common nonlinear components where EMI ca

K-Band vs. Ka-Band FrequenciesKey Takeaways-K-band frequency communication offers good short-range, high throughput, and high resolution.-With focused spot beam and multiple beam technology, Ka-band frequency can be reused, which improves the capacity as w

PCB Land PatternsKey Takeaways-The standard features that comprise a land pattern.-Alternate methods of land pattern creation.-Steps to follow for land pattern creation to minimize work duplication and the chance of error in translating manufacturer’s data

Ka-Band Microwave Power ModulesKey Takeaways-Microwave power modules were developed as compact and highly efficient solutions to replace conventional traveling wave tube amplifiers.-The traveling wave tubes are employed as booster amplifiers in microwave p

Op-Amp Application CircuitsKey Takeaways-The op-amp differential amplifier features low output resistance, high input resistance, and high open loop gain.-In an inverting amplifier configuration, the op-amp circuit output gain is negative.-All simple mathe

Joule's Law of Electric Heating

How Does a Power Regulator Feedback Loop WorkPower regulator circuits, both linear and switching regulators, include feedback loops as mechanisms to ensure the circuit outputs at a target voltage. These feedback loops play a simple but important role in po

The Frequency Response of VRMsAll VRMs used for high-speed digital processors are intended to provide power at high speeds, while also maintaining stable output for voltage droop and ripple. VRMs also perform important management tasks through voltage/freq

Should You Use a Custom or Standard Connector PinoutNo one will argue with the idea that a USB protocol should probably be routed over a USB connector and standardized cable. These and other connector types have standardized pinouts, and the equipment has

What is Oscilloscope Probe CompensationOscilloscope probes are one of the determining factors that determine the accuracy of fast sampled signals. To ensure accuracy during a live measurement of a high-speed signal or high-frequency waveform, a technique k

What is Diode Reverse Recovery TimeThe most important uses of diodes are not in DC conduction, they are actually in AC circuits. The fact that AC circuits are time-dependent also means that diodes have time-dependent characteristics that affect operation,

The Dielectric Material Used in Capacitors

PCB Footprint Design GuidelinesKey TakeawaysThe PCB footprint is the physical interface between the component and the circuit board.The PCB footprint gives the designated locations to solder the components as per the design.IPC-7351 is the standard that en

QFN Package DimensionsKey TakeawaysQuad flat no-lead (QFN) packages are lead frames used for connecting ICs to printed circuit boards.QFN package dimensions are designed to give a small form factor that provides a thin profile.The PCB footprint design shou

A Look at Factors Causing TombstoningThere is one SMD defect that everyone likes to focus on, including new designers: tombstoning. This simple defect results when an SMD component lifts off one of its pads and stands up on the board. Tombstoning doesn’t n

How Does Solder Paste Composition Affect Tombstoning Solder paste composition varies greatly with many compositions available for purchase. Solder pastes affect reliability and assembly capability, as well as the potential for tombstoning on small SMD pass

MMICPADesignKeyTakeawaysPoweramplifiersareusedforconvertingDCinputpowerintosignificantRFormicrowaveoutputpower.Tomeetsize,cost,andreliabilityrequirements,monolithicmicrowaveintegratedcircuit(MMIC)technologyisutilizedinpowe

Thermal Considerations For Printed Circuit Board DesignersBeing cool used to be easy. Modern times call for a more comprehensive approach to keeping the lights on when it comes to our PCB layouts. The early days of electronics saw through-hole components b

Different Methods of SolderingWhen thinking of soldering, the first image that comes to mind is the soldering iron and solder in the form of a small spool of a wire that has a rosin core which works as a fluxing agent. Soldering irons are pretty simple, co

Class 3 PCB Design RulesKey TakeawaysIPC PCB classifications and the added requirements of Class 3.A brief cost analysis of IPC Classes.The impact of Class 3 on design rules for DFM layout.Class 3 PCB design rules involve enhanced visual inspection for def

FansHeat sinks。

Electrostatic Discharge (ESD) Protection Design GuideKey TakeawaysElectrostatic Discharge (ESD) is the momentary flow of electric current between two electrically charged objects.ESD failures can be segmented into soft failures, latent defects, and catastr

RF Power Divider DesignKey TakeawaysAn RF power divider is a three-port device that provides RF power division or RF power combining.RF power dividers are extensively employed in measurement systems, radars, high-power amplifiers, phased array antennae, et

Satellite Frequency BandsKey TakeawaysMost satellite communication systems are used for providing service to an assigned geographical area on the Earth’s surface.The satellite wireless communication infrastructure uses two resources: orbit and spectrum.Fre

Types of Embedded Capacitors for PCBs, Chips, and PackagesDecoupling capacitors are just the first place for systems designers to start building digital systems with sufficient power integrity. While decoupling/bypass capacitors are still a standard strate

Controlled Impedance vs. Controlled Stackup DesignHigh-speed designs and RF designs need to have consistent impedance for routed signals, and the impedance challenge is normally approached in two possible ways. These approaches include controlled impedance

Should Venting Be Used With No-Clean Solder PasteIt is often recommended that PCB assembly end with cleaning of any residues on or around components. However, this is sometimes easier said than done. Some components that are soldered with no-clean flux wil

How to Prevent Solder Voiding in Bottom-Terminated ComponentsThe large exposed pad with the array of vias in the above image is often fully coated with solder paste prior to reflow. While the intention is to ensure the strongest possible bond in the device

Types of Surge Arrester Devices for PCBsA device that experiences a power surge might have a tough time surviving without some circuitry to absorb or divert excess electrical energy. The ability to withstand power surges is also a requirement in design for

Should You Trust Electronic Component BrokersFor all the technological advances the electronics industry has ushered into world markets, there is one problem that it continuously fails to address: counterfeit electronics. In fact, counterfeiting techniques

Reflow and Rework Rules for Flex PCBAsFlex PCBs and rigid-flex PCBs offer many useful advantages over rigid boards, such as in devices like wearables and mil-aero. The flex section is built from polyimide-based materials and adhesives, as well as copper fo

Modern Design For Cost is More Than Just Component PricesIt is well known that the electronics supply chain has become highly globalized over the past two decades. There are areas of geographic concentration in the supply chain, where certain fabrication c

Op-Amp Compensation Methods to Ensure StabilityOp-amps that enter instability will exhibit oscillations and ringing, which might persist or grow depending on reactances in the feedback loop. To help deal with these problems, there are additional components

Bode plots。

Flyback Converter Equations and Design StepsFlyback converters are common in systems that require multiple outputs when converting AC to DC. They can also provide isolation that protects the user working on the output side of a system, which is why they ar

Why Does My Op-Amp OscillateThe classic DIP-8 op-amp components you’ll find with old lab equipment are incredibly useful and versatile components. More powerful and specialized op-amps are not normally supplied in the older DIP package, and instead they ar

Satellite Frequency Allocation and the Band SpectrumKey TakeawaysSatellite frequency allocation and band spectrum usage are coordinated by the International Telecommunication Union (ITU).Spectrum efficiency indicates the amount of data transfer possible ov

Uplink and Downlink FrequencyKey TakeawaysThe process of transmitting data from the user device to wireless communication network infrastructure is called uplink.The downlink process connects the satellite to the ground station receiver.The uplink and down

The IC Packaging ProcessKey TakeawaysWafer fabrication creates the die, which is the heart of an IC.The encapsulation of the die creates a discrete IC.The attributes of different packages and how the layout can leverage them.The IC packaging process result

Very-Large-Scale IntegrationKey TakeawaysThe benefits of shrinking transistor sizes on total electrical performance.Further methods of IC integration for special use cases.Bottom-level design techniques to optimize wafer layout.Very-large-scale integration