OCP(open compute project)

最新推荐文章于 2024-03-26 09:48:08 发布

转载最新推荐文章于 2024-03-26 09:48:08 发布 · 414 阅读

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原文链接：https://yq.aliyun.com/articles/458859

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#人工智能

本文概述了开放计算项目(OCP)中的三个核心领域：硬件管理(Hardware Management)，高性能计算(HPC)及网络(Networking)的主要研究方向与工作内容。硬件管理聚焦于通过自动化流程提升管理效率；高性能计算则涉及低延迟网络、存储解决方案及开放硬件开发；网络方面则关注无线解决方案、安装环境及软件接口等。

http://www.opencompute.org/

项目列表：

3、HARDWARE Management

OpenBMC - framework & processes to contribute code, manage source tree & check-in process, oversee build tools and utilities.
Rack Management Controllers- Rack level management solutions (HW, SW, API) and technologies. Review, recommend, collaborate on RM contributions
DMTF Redfish API - review & adopt initial “OCP profile”
Provide uniform management of firmware, alerting of hardware events and remote hardware access. Our focus will be on process automation and scalability by leveraging existing open standards whenever possible. We will coordinate with other groups within the OCP foundation to drive efforts.
Provide a required process for submitting specifications to other workgroups that include a specification for hardware mgmt. The hardware management group will provide a template containing a recommended set or actions and events.

4、HPC

HPC Project Scope:

• Low latency top of rack switching

• Combined Switch and micro servers

• Combined compute and switching

• Low latency scalable storage

• Connectivity from HPC Fabrics/clustering technology to out of cluster networking via ethernet

• OCP mechanicals (19 and 21 inch)

• APIs and software interfaces

• Open Hardware compute and switching Development of OCP HPC Interconnect silicon spec (can build on existing mainstream technologies such as PCIe, RapidIO, Infiniband, Ethernet)

5、NETWORKING

Campus Branch Wireless (CBW)

Open Network Install Environment (ONIE)

Open Network Linux (ONL)

SONIC

Switch Abstraction Interface (SAI)