2014年 Thinking of Technical Challenge of Hardware Design

• Circuit design: analog circuit, digital circuit
• Semiconductor: diode, transistor, MOSFET etc.
• Components selection
• Power Supply Subsystem
  • AC/DC
  • DC/DC
  • LDO
  • PWM
  • Power Consumption
  • Power Sequence
  • Hot Swap
• Clocking Subsystem
  • Oscillator/Crystal
  • Buffer and Distributor
• Reset Subsystem
  • Topology
  • Power on Reset
  • Watchdog
  • Reset Sequence
• Ethernet Subsystem
  • Switch
  • PHY
  • GMII/SGMII/XAUI/RXAUI/KR/SFI/XFI
  • Transformer/RJ45
  • SFP/XFP
• NPU/CPU Subsystem(Control Plane)
  • FLASH
  • DRAM, DDR
  • JTAG
• BSP Software: Register, Driver, Bootloader
• Thermal Design, Simulation and Test

• High Speed Design

RockyHardware Hierarchy

 

ApplicationSoftware

 

BSP/Driver

 

CPUSystem -Control Plane

 

ASICsystem - Data plane

 

Clock/reset 

powersystem  

 

SoftwareLayer

CircuitLayer

Electromagnetic 

Physics

 

Art/beauty 

 

Standard/protocol

• Environmental Protection
  • Power Saving
  • Green
  • ROHS/WEEE/REACH
• Certification
  • CE
  • FCC
  • EMC
  • Safety
• Reliability
  • Thermal
  • Temperature
  • Shock/Drop

Business

- Price

--Product Cost

-- RDCost

- Time

--Time toMarket ( RD Time, NPI Time)

-- LeadTime

-

 

SupplyChain

-Manufacturers

- Vendors

-Qualification

-Relation

-Quotation

- PaymentTerm

- MOQ

- LeadTime

-Delivery Term

-Sourcing